Michael D. Savagian of Germantown, Wis., and Steven H. Mess of Franklin, Wis., have developed a label for use as an in-mold label that includes a radio frequency identification device (RFID).
According to the U.S. Patent & Trademark Office (Alexandria, Va.): "The label includes an RFID having opposed first and second surfaces; a first layer of heat-activated adhesive disposed on the first surface of the RFID; a second layer of heat-activated adhesive disposed on the second surface of the RFID; and a surface layer comprising a polymeric film disposed on a surface of the first layer of heat-activated adhesive opposite the first surface of the RFID."
An abstract of the invention, released by the Patent Office, said, "The label is placed in a mold with the surface layer contacting the mold. A polymer is molded in the mold such that the second layer of heat-activated adhesive (or a surface layer over the second layer of heat-activated adhesive) adheres to the polymer thereby producing a labeled article that can be identified using the radio frequency identification device in the label."
The inventors were issued U.S. Patent No. 7,135,979.
The patent has been assigned to Brady Worldwide Inc., Milwaukee.
Source: US Fed News
